Jobs
Headway offers competitive
salaries, an outstanding benefits package and significant opportunities
for professional growth.
We currently have the following openings:
Headway is an Equal Opportunity Employer. We consider all applicants without
regard to race, religion, sex, color, national origin, ancestry, age, marital
status, medical condition, sexual orientation, disability, or status as a
disabled veteran or veteran of the Vietnam era.
CMP R&D Engineer
- General Summary
This position will be responsible for the development of new wafer CMP and wafer cleaning processes for future generation magnetic recording heads and for the CMP support of prototype builds.
- Principle Duties and Responsibilities
- Develop new CMP processes and post-CMP cleaning processes.
- Design and conduct independent experiments.
- Work closely with consumables suppliers on product development for new applications.
- Provide CMP support for prototype builds for next generation products.
- Work closely with manufacturing engineering team to transfer new CMP and cleaning processes into manufacturing.
- Work with other engineering departments on designs incorporating CMP and on CMP integration issues.
- Direct the work of CMP technicians.
- Job Specification and Requirements*
- Excellent communication skills, both written and oral.
- Requires analytical and decision making skills related to selection of process material, resolution of process and metrology issues.
- Able to work and interact with various interdepartmental engineering and other support organizations.
- Minimum of 2 years of wafer CMP process development, preferably in the magnetic heads or semiconductor industries.
- Experience with a wide range of metrology, including AFM and optical inspection metrology.
- Minimum B.S. degree in Chemistry, Material Science, Physics, Engineering or related fields; M.S. or Ph.D. preferred.
- Work Schedule, Conditions and Physical Requirements ***
This is a day shift position, Monday through Friday. Regular work schedule may occasionally be adjusted to meet company needs. A significant amount of time will require the individual to be on his feet within a class 100 ESD sensitive wafer fab manufacturing facility requiring strict adherence to safety and dress standard, including but not limited to smocks, hairnets, safety shoes, glasses, nitrile gloves, etc.
* Related duties as required are duties that may not be specifically listed in the classification specification or position description.
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Equipment Engineer Manager
- General Summary
Under the direction of the Director, Equipment Engineering and Maintenance, this position will be responsible for strategic planning, project management, budgeting, and training development. Provide leadership and management for staff of 10+ equipment engineers to sustain wafer fab equipment.
- Principle Duties and Responsibilities
- Oversee and manage equipment engineers in thin films/photolithography/plate.
- Provide leadership and support to ensure goals are met in equipment metrics.
- Optimize equipment improvements to improve availability/MTBF/MTTR.
- Develop documentation for consistency in operations.
- Implement cost reduction concepts through reduction in consumable usage, improved equipment performance & efficiencies.
- Project management, strategic planning and tool installation.
- Work with other managers/groups in cross-functional teams.
- Provide leadership and guidance to team in troubleshooting tool issues.
- Improve yield and tool performance.
- Job Specification and Requirements*
- Knowledge and experience in Vacuum/Photolithography/Plate/Polish equipment.
- Hands-on experience work on wafer fab equipment.
- Management and leadership experience.
- Strong computer skills required.
- Effectively lead technical meetings and presentation.
- Strong troubleshooting skills and failure analysis required.
- In depth knowledge of data mining and analysis, statistical process control, and design of experiments.
- Budget experience required.
- RF and electronic skills required.
- BS in Electrical/Mechanical engineering.
- 10 years experience in wafer fab manufacturing.
- Must interact well with interdepartmental engineering, internal support organizations and vendors. Route interaction with manufacturing engineers, OEM (Original Equipment Manufacturer), Maintenance, failure analysis engineers, and Facilities/EHS.
- Work Schedule, Conditions and Physical Requirements ***
Work schedule is from Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. Majority of the time for this position will be in an office/cube environment. Some travel may be required to evaluate OEM (Original Equipment Manufacturing). A significant amount of time will be in the wafer fab requiring adherence to the safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, nitrile gloves, etc. Physical requirements include manual dexterity, lifting, bending, reaching and standing to work on equipment. Occasional lifting of up to 50 lbs may be required. Some areas will have high noise levels. Contact with hazardous chemicals, fumes or airborne particles may occur. Certain aspects of this job require the use of a respirator, therefore; individuals must shave facial hair in accordance with OSHA requirements and must pass a physical exam that certifies that they are physically fit to wear a respirator.
* Related duties as required are duties that may not be specifically listed in the classification specification or position description.
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Equipment Maintenance Technician
- General Summary
Under the general direction of the Maintenance Supervisor, perform the preventive maintenance, repair and troubleshooting of equipment on night shifts. Tool experience on the following toolsets preferred:
| Vacuum | Photolithography | Plate / Polish |
| Veeco Ion Beam Dep and Etch Systems | Nikon Steppers | AMAT Mirra Polishers |
| Alcatel Comptechs Sputtering Systems | ASML Scanners | Strausbaugh Polishers |
| Anelva 7100 | DNS Inline Coat/Dev Systems | ECO-Snow wafer cleaners |
| Balzers/Corona/Emerald CVC | Perkin Elmer/Beta Squared 600 Series | TOMCO Plating systsms |
| Plasma-Therm RIE | KLA and AMAT CD-SEMS | Betcher and Amerimade Sytems |
| | Certus Focused Ion Beam Systems | SEMITOOL wafer cleaners |
- Principle Duties and Responsibilities
- Ability to perform preventative maintenance and timely repairs on multiple toolsets.
- Maintain the optimum performance of equipment through scheduled PMs and calibration of equipment.
- Troubleshoot and repair down equipment.
- Interface and passdown with incoming and outgoing shifts.
- Work with engineering and other cross functional groups to resolve maintenance issues, improve equipment reliability and minimize equipment downtime.
- Support continuous improvement activities for productivity and yield enhancement.
- Perform other duties and tasks as assigned.
- Job Specification and Requirements*
- Ability to read and interpret electrical, pneumatic, hydraulic/fluid schematics, and OEM/company operating and maintenance instruction manuals.
- Knowledge of Microsoft Office, Computerized Maint. Management System, Automated Production Control Systems.
- Must be able to communicate, contribute and work effectively with interdepartmental groups and in a team environment.
- Ability to work and take directions from written and verbal instructions.
- Ability to write routine reports detailing corrective and preventative actions.
- Able to read schematics and mechanical drawings.
- AA/AS preferred or an equivalent combination of experience. Military experience acceptable.
- Able to manually handle shop tools and machining equipment.
- Occasional travel may be required.
- Work Schedule, Conditions and Physical Requirements ***
Monday - Wednesday, every other Thursday Noon - Midnight*
Friday - Sunday, every other Thursday Noon - Midnight*
Occasional overtime hours may be needed to support production needs. Flexible to work overtime and/or different shifts as business shifts as business needs dictate. The individual will be required to work in a class 100 and ESD sensitive environment, requiring adherence to safety and dress standard, including but not limited to bunnysuits, safety shoes, safety glasses, nitrile gloves, etc. Some areas will have high noise levels. Occasional contact with hazardous chemicals, fumes, or airborne particles will be necessary. Must be able to lift a minimum of 50 lbs. Physical requirement include manual dexterity, good hand-eye coordination, able to lift, bend, crawl, pull, push, reach, walk, hear, and talk. Certain aspects of this job require the use of a respirator, therefore; individuals must shave facial hair in accordance with OSHA requirements and must pass a physical exam that certifies that they are physically fit to wear a respirator.
* Related duties as required are duties that may not be specifically listed in the classification specification or position description.
Apply Now
Plating Manufacturing Engineer
- General Summary
This position will support the plating manufacturing process under the direction of the Plating Engineering Manager.
- Principle Duties and Responsibilities
- Monitor and sustain yield/throughput improvement on manufacturing processes.
- Provide technical support to the plating area. Emphasis will be quality control on plating solutions and etching solution preparation.
- Resolve line down situations and use failure analysis to investigate root causes of problems.
- Provide technical support to special engineering projects and assignments.
- Improve and optimize existing plating processes.
- Job Specification and Requirements*
- Must be able to interact with interdepartmental engineering and other support groups.
- Proven training/college course work on analytical chemistry is required.
- Must be able to work and support a demanding manufacturing environment.
- Should be self-motivated and able to work independently with minimal supervision.
- Minimum M.S. degree in Chemistry, Electrochemistry, Chemical Engineering, or Material Science. Ph.D. preferred.
- Work Schedule, Conditions and Physical Requirements ***
This is a day shift position, Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. A significant amount of time will require the individual to work in a class 100 ESD sensitive wafer fab manufacturing facility requiring adherence to safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, etc.
* Related duties as required are duties that may not be specifically listed in the classification specification or position description.
Apply Now
Photolithography Manufacturing Engineer
Responsible for supporting the thin film head photolithography manufacturing process; supporting resist coat and developing equipment from the process side and organizing tool optimization efforts; designing experiments to optimize photoresist processes through simulation, modeling and experimental techniques; assisting in the implementation of new products and processes into manufacturing; setting-up procedures and systems for process monitoring; developing new processes and evaluating new materials to improve process capability and yield; monitoring, sustaining and supporting manufacturing processes and activities; defining and implementing yield improvement and reworking reduction activities cross functionally with other engineering departments; improving processes through failure analysis and defect reduction; implementing and qualifying new tools materials and processes; and evaluating and monitoring photolithography equipment performance and stability.
Master's degree or equivalent in Electrical Engineering or Chemical Engineering plus one year of experience as a Photolithography Manufacturing Engineer, Materials Science Research Associate or in a related occupation. In lieu of a Master’s degree or equivalent and one year of experience, will also accept a Bachelor's or equivalent in Electrical Engineering or Chemical Engineering plus five years of progressively responsible experience as a Photolithography Manufacturing Engineer, Materials Science Research Associate or a related occupation. Will accept any suitable combination of education, training or experience equivalent to a Master's degree or equivalent and one year of experience or a Bachelor's degree or equivalent and five years of experience.
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Quality Control Manufacturing Engineer
- General Summary
This position will support the Quality Control Manufacturing Engineering under the direction of the Quality Control Manufacturing Engineering Manager.
- Principle Duties and Responsibilities
- Monitor and sustain yield improvement on manufacturing processes.
- Provide statistical analysis, failure analysis to concerned area. Emphasis will be application of SPC to achieve prescribed Cp, Cpk objectives.
- Improve and optimize existing processes through SPC methodology.
- Provide technical support to special engineering projects and assignments.
- Job Specification and Requirements*
- Must be able to interact with interdepartmental engineering and other support groups.
- Proven training/college course work or industrial experiences on SPC, FA skills like able to run FIB are required.
- Proficiency on Microsoft Office or other statistical applications is preferred.
- Must be able to work and support a demanding manufacturing environment.
- Should be self-motivated and able to work independently with minimal supervision.
- Minimum B.S. degree in physical sciences/engineering disciplines.
- Work Schedule, Conditions and Physical Requirements ***
This is a day shift position, Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. A significant amount of time will require the individual to work in a class 100 ESD sensitive wafer fab manufacturing facility requiring adherence to safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, etc.
* Related duties as required are duties that may not be specifically listed in the classification specification or position description.
Apply Now
Thin Film Manufacturing Engineering Manager
- Principle Duties and Responsibilities
- Manages a group of 6 highly skilled engineers.
- Provides engineering skills and leadership necessary to support and sustain vacuum related processes including PVD, CVD, IBD, IBE, RIE, FIBE & magnetic annealing.
- Conducts yield improvement studies to ensure process robustness and to improve efficiency of manufacturing process.
- Transfers new vacuum processes from development phase into volume production.
- Coordinates with vendors and suppliers to evaluate new vacuum equipments or obtain new hardware/software parts to meet new process and/or capacity requirements.
- Evaluates new sputtering targets for quality and cost savings and specifies incoming targets inspection criteria.
- Job Specification and Requirements*
- Extensive experience in high vacuum systems utilized in semiconductor or thin film head industries.
- Hands-on experience in thin film fabrication using rf-diode, rf/dc-magnetron sputtering, & ion beam techniques.
- Strong background in sold state physics, semiconductor physics, magnetism, and magnetic recording technology.
- Hands-on experience in surface analytical/materials characterization techniques such as X-ray diffraction (XRD), atomic force microscopy (AFM), transmission electron microscopy (TEM), focus ion beam microscopy (FIB), and scanning electron microscopy (SEM).
- Experience in semiconductor device testing and magnetic testing such as I-V, C-V, M-H hysteresis, and magnetoresistivity.
- Experience on design of experiments (DOE) for process optimization and statistical process control (SPC) for product quality monitoring.
- Good communication skills and self-motivated.
- MS (PhD preferred) in Physics or Materials Science with 3+ years experience in AMR/Spin-valve/GMR/TMR processing and characterization.
- Work Schedule, Conditions and Physical Requirements ***
This is a day shift position, Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. A significant amount of time will require the individual to work in a class 100 ESD sensitive wafer fab manufacturing facility requiring adherence to safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, nitrile gloves, etc.
* Related duties as required are duties that may not be specifically listed in the classification specification or position description.
Apply Now
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