Jobs

Headway offers competitive salaries, an outstanding benefits package and significant opportunities for professional growth.

We currently have the following openings:

Headway is an Equal Opportunity Employer. We consider all applicants without regard to race, religion, sex, color, national origin, ancestry, age, marital status, medical condition, sexual orientation, disability, or status as a disabled veteran or veteran of the Vietnam era.

Automation Engineer

  • General Summary


      • This position will be responsible for developing software for fault detection modeling on semiconductor equipment using third party software packages.

  • Principle Duties and Responsibilities


    • Work with equipment, manufacturing, process and QA engineering to develop models for equipment performance and enhance wafer yield improvement.
    • Work with MIS (Manufacturing Information System) Department, equipment and software vendors for initial networking communication development and integration.
    • Monitor and optimize FDC (Fault Detection and Classification) system performance.
    • Summarize model requirements through data collection and analyzes.
    • Develop reporting schemes and process solutions for equipments to enable quick response time to resolve equipment issues.

  • Job Specification and Requirements*


    • Requires excellent communication and analytical skills.
    • Must be able to work and interact with various interdepartmental engineering and other support organizations.
    • Use creativity and analytical thinking to realize ideas from engineering quickly and cost effectively.
    • Be able to work independently and should be self-directed.
    • Experience in software or hardware modeling/simulation.
    • Experience with Adventa TIMS a plus.
    • Working knowledge of Java, C/C++, Shell-Scripting, Visual Basic programming languages and familiar with Oracle and SQL databases and MATLAB.
    • Familiar with Windows OS, Windows Office, Linux OS, computer networking.
    • Knowledge of logic design, semiconductor fabrication, time series analysis, statistical quality control helpful.
    • Minimum B.S. degree in Computer Science, Computer Engineering, Electrical Engineering or Mechanical Engineering.

  • Work Schedule, Conditions and Physical Requirements ***


      • This is a "Day" shift position, Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. Occasionally, the individual will be required to be within a class 100 ESD sensitive wafer fab manufacturing facility requiring adherence to safety and dress standards, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, yellow light, etc.

* Related duties as required are duties that may not be specifically listed in the classification specification or position description.

Apply Now

Equipment Engineer

  • General Summary


      • This position will be responsible for the evaluation, selection, order installation, modification, upgrade and maintenance of manufacturing equipment under the direction of the Equipment Engineering Manager.

  • Principle Duties and Responsibilities


    • Collect data, chart, and analyses of information for equipment.
    • Oversee and manage the installation, modification, upgrade and maintenance of manufacturing equipment.
    • Keep current on equipment manufacturer’s technical notices, upgrades and safety issues.
    • Study equipment performance and reliability.
    • Develop production tool recovery planning during emergency tool down situations.
    • Schedule and manage equipment and manufacturing and improvement projects.
    • Provide technical support to equipment maintenance and other manufacturing organizations.
    • Define preventive maintenance procedures and schedules.
    • Serve as the principle contact for equipment vendors and services.

  • Job Specification and Requirements*


    • Common requirements for all Equipment Engineer positions
      • Have excellent written and oral communication.
      • Be proficient with MS Window software (Excel), CAD or similar software knowledge.
      • For Vacuum & Photo, hands on experience with metrology tools for parametric film measurement and defect inspection.
      • Experience in (TFH) Thin Film Head fabrication strongly preferred for vacuum and photo.
      • Must interact well with interdepartmental engineering, internal support organizations and vendors.
      • Focus on quality and service when dealing with suppliers of equipment parts and material.
      • Ability to multitask projects and handle responsibilities that will affect the productivity and utilization of his/her equipment tool set with emphasis on material costs, quality and service from provider.
      • Must be able to make determinations/decisions on critical equipment situations, with consideration to all data, study, experience, etc.
      • Requires occasional travel to perform source acceptance at OEM site or perform technology transfer.
      • Prefer 15+ years as an equipment engineer or similar field.
      • Minimum AA degree, BS preferred or equivalent experience and/or military electronics training.

    • Specific requirements for Vacuum Equipment Engineer
      • Advanced knowledge of thin films deposition and etch tools such as RF Diode, RF Mag, DC Mag, PECVD, RIE, ICP and Ion Mill.
      • Possess basic knowledge of chemistry and plasma physics.
      • Have a basic understanding of digital and analog electronics, machine design, fluid dynamics and thermo dynamics.

    • Specific requirements for Photo Equipment Engineer
      • Advanced knowledge of the photolithography process, including experience with Scanners, Steppers, Track Coat and Bake systems.
      • Have a basic understanding of digital and analog electronics, machine design, fluid dynamics and thermo dynamics.

    • Specific requirements for Plating Equipment Engineer
      • Advanced experience on Plating and Etch equipment maintenance such as Plating Stations, Resist Strippers, Etch Wet benches, and SRD equipment.
      • Have an in depth understanding of electronics, electro-mechanical, and pneumatic principles.
      • Be proficient on the use of profilometers, XRF tools and SEM tools.
      • Knowledge of CMP, wafer polish and wafer clean equipment helpful.

  • Work Schedule, Conditions and Physical Requirements


      • Work schedule is from Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. Majority of the time for this position will be in an office/cube environment. A significant amount of time will be in the wafer fab requiring adherence to the safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, etc. Physical requirements include manual dexterity, lifting, bending, reaching and standing to work on equipment. Occasional lifting of up to 50 lbs may be required. Some areas will have high noise levels. Contact with hazardous chemicals, fumes or airborne particles may occur. Certain aspects of this job require the use of a respirator, therefore; individuals must shave facial hair in accordance with OSHA requirements and must pass a physical exam that certifies that they are physically fit to wear a respirator.

* Related duties as required are duties that may not be specifically listed in the classification specification or position description.

Apply Now

Equipment Maintenance Technician

  • General Summary


      • Under the general direction of the Maintenance Supervisor, perform the preventive maintenance, repair and troubleshooting of equipment on night shifts. Tool experience on the following toolsets preferred:

    Vacuum Photolithography Plate/Polish
    Veeco Ion Beam Dep and Etch Systems Nikon Steppers AMAT Mirra Polishers
    Alcatel Comptechs Sputtering Systems ASML Scanners Strausbaugh Polishers
    Anelva 7100 DNS Inline Coat/Dev Systems ECO-Snow wafer cleaners
    Balzers/Corona/Emerald CVC Perkin Elmer/Beta Squared 600 Series TOMCO Plating systsms
    Plasma-Therm RIE KLA and AMAT CD-SEMS Betcher and Amerimade Sytems
      Certus Focused Ion Beam Systems SEMITOOL wafer cleaners

  • Principle Duties and Responsibilities


    • Ability to perform preventative maintenance and timely repairs on multiple toolsets.
    • Maintain the optimum performance of equipment through scheduled PMs and calibration of equipment.
    • Troubleshoot and repair down equipment.
    • Interface and passdown with incoming and outgoing shifts.
    • Work with engineering and other cross functional groups to resolve maintenance issues, improve equipment reliability and minimize equipment downtime.
    • Support continuous improvement activities for productivity and yield enhancement.
    • Perform other duties and tasks as assigned.

  • Job Specification and Requirements*


    • Ability to read and interpret electrical, pneumatic, hydraulic/fluid schematics, and OEM/company operating and maintenance instruction manuals.
    • Knowledge of Microsoft Office, Computerized Maint. Management System, Automated Production Control Systems.
    • Must be able to communicate, contribute and work effectively with interdepartmental groups and in a team environment.
    • Ability to work and take directions from written and verbal instructions.
    • Ability to write routine reports detailing corrective and preventative actions.
    • Able to read schematics and mechanical drawings.
    • AA/AS preferred or an equivalent combination of experience. Military experience acceptable.
    • Able to manually handle shop tools and machining equipment.
    • Occasional travel may be required.

  • Work Schedule, Conditions and Physical Requirements ***


      • D Shift: Friday - Sunday, every other Thursday, 6pm-6am*

      Occasional overtime hours may be needed to support production needs. Flexible to work overtime and/or different shifts as business shifts as business needs dictate. The individual will be required to work in a class 100 and ESD sensitive environment, requiring adherence to safety and dress standard, including but not limited to bunnysuits, safety shoes, safety glasses, latex gloves, etc. Some areas will have high noise levels. Occasional contact with hazardous chemicals, fumes, or airborne particles will be necessary. Must be able to lift a minimum of 50 lbs. Physical requirement include manual dexterity, good hand-eye coordination, able to lift, bend, crawl, pull, push, reach, walk, hear, and talk. Certain aspects of this job require the use of a respirator, therefore; individuals must shave facial hair in accordance with OSHA requirements and must pass a physical exam that certifies that they are physically fit to wear a respirator.

* Related duties as required are duties that may not be specifically listed in the classification specification or position description.

Apply Now

Plating Manufacturing Engineer

  • General Summary


      • This position will support wafer cleaning and wet etch processes under the direction of the Plating Engineering Manager.

  • Principle Duties and Responsibilities


    • Monitor and sustain yield/throughput improvement on manufacturing processes.
    • Provide technical support to wafer cleaning and wet etch area. Emphasis will be quality control on out going wafers from responsible area.
    • Resolve line down situations and use failure analysis to investigate root causes of problems.
    • Provide technical support to special engineering projects and assignments.
    • Improve and optimize existing wafer cleaning and wet etch processes.

  • Job Specification and Requirements*


    • Must be able to interact with interdepartmental engineering and other support groups.
    • Proven training/college course work on analytical chemistry is required.
    • Must be able to work and support a demanding manufacturing environment.
    • Should be self-motivated and able to work independently with minimal supervision.
    • Minimum B.S. degree in Chemistry, Chemical Engineering, Material Science, or other physical sciences disciplines.

  • Work Schedule, Conditions and Physical Requirements ***


      • This is a day shift position, Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. A significant amount of time will require the individual to work in a class 100 ESD sensitive wafer fab manufacturing facility requiring adherence to safety and dress standard, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, etc.

* Related duties as required are duties that may not be specifically listed in the classification specification or position description.

Apply Now

Process Characterization/Integration Engineer

  • General Summary


      • This position will be responsible for the process characterization and integration of prototype wafers on new technology programs and future generation products.

  • Principle Duties and Responsibilities


    • Process integration for prototype wafers on new technology and future products.
    • Process characterization for further process improvement on new prototype wafers.
    • Data analysis on TEM/SEM Dual Beam and other related metrology feedback.
    • Work closely with process engineering, product engineering, and design group to ensure to meet product requirements.
    • Work on process transfer into manufacturing.
    • Failure analysis on newly developed process and provide corrective actions.

  • Job Specification and Requirements*


    • Excellent communication and analytical skills.
    • Must be able to work and interact with various interdepartmental engineering and other support organizations.
    • Be able to work independently and should be self-directed.
    • Experience in fabrication process on magnetic heads, hard disk drive, or semiconductor industry.
    • Experience in magnetic response and testing is a plus.
    • Experience in thin film/photolithography process is helpful.
    • Experience with a wide range of metrology tools such as TEM, SEM, FIB helpful.
    • Minimum M.S. degree in Material Science, Physics, Electrical Engineering or other engineering discipline. Ph.D. preferred.

  • Work Schedule, Conditions and Physical Requirements ***


      • This is a "Day" shift position, Monday through Friday. Regular work schedule may periodically be adjusted to meet company needs. Occasionally, the individual will be required to work within a class 100 ESD sensitive wafer fab manufacturing facility requiring adherence to safety and dress standards, including but not limited to bunnysuits, safety shoes, glasses, latex gloves, yellow light, etc.

* Related duties as required are duties that may not be specifically listed in the classification specification or position description.

Apply Now